Three dimensional CFD simulation of non-Newtonian flow for the underfill flow in flip chip packaging
نویسندگان
چکیده
In the present paper, a finite volume method (FVM) based software is used in the simulation of simulation of non Newtonian flow between two parallel plates and flip chip packaging are presented. 3D of two parallel plates with different gap heights are developed and simulated by Computational Fluid Dynamic (CFD) code, FLUENT 6.3.26. The power law equation was used to describe the NonNewtonian behaviour of encapsulant fluids and the volume of fluid (VOF) technique was applied for the flow front tracking. The underfill process for two parallel plates and the effect of gap height were studied in the present work. The comparison between the simulation results and previous experimental results are found to be good conformity. Thus, the modelling of non-Newtonian underfill flow behaviour using the power law model for a 3D model of two parallel plates is proven to be excellent.
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